Everything about Noohapou
Everything about Noohapou
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The POU3500 method offers dynamic temperature Charge of the method chamber cathode / electrode / anode and can be synchronized with any etch system.
30% of its peak electricity use, supplying our clients significant reduction in functioning expenses and improved reliability.
the data down below is classified by semiconductor procedure and Software producer. Every table consists of an purposes Matrix that shows qulified and business processes.
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This extraordinary technique, supplying a little sort factor, inexpensive-of-possession and Dynamic Temperature Regulate provided course of action and equipment engineers a different tool to enhance their temperature sensitive procedures.
we've been guided in our belief that prosperity Within this aggressive marketplace stems from supplying consumers with highly engineered new products and entire world class customer support.
All static TCUs need excessive cooling & heating capacities due to their really huge method fluid reservoirs. the method fuid reservoir on LAUDA-Noah's dynamic temperature Regulate process is below one gallon.
With our device strategically mounted close to six feet within the chamber, we reach a way more exact reading of your chuck temperature. This solution ensures dependable temperature all over the manufacturing large amount, bringing about improved wafer-to-wafer CD uniformity.
significant Footprint: Static models occupy considerable Room inside the fabrication Device area, minimizing its effectiveness.
LAUDA-Noah is meeting these new issues and it has included Vitality saving technological know-how in programs which can be friendly towards the surroundings and have a affordable to operate.
The TEs' can change straight from heating to cooling, or visa-versa. They can switch on & off even though in the heating or cooling method and can increase or minimize the amount of heating or cooling without having switching by any means.
The POU3300 procedure features dynamic temperature Charge of the method check here chamber cathode / electrode / anode and can be synchronized with any etch process.
Confirmed; TEs' stand for only one Component of a chiller's style and design. The switching & Regulate approaches used by a chiller will influence the TEs' reliability.
(hence, installing a static device beside chamber is not going to enable it to supply dynamic temperature Command)
We need much less cooling/heating capability for a similar application as a static TCU thanks to our compact reservoir volume.
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